“PCBend: Light Up Your 3D Shapes With Foldable Circuit Boards” by Freire, Bhargava, Schreck, Hugron, Bickel, et al. …

  • ©Marco Freire, Manas Bhargava, Camille Schreck, Pierre-Alexandre Hugron, Bernd Bickel, and Sylvain Lefebvre




    PCBend: Light Up Your 3D Shapes With Foldable Circuit Boards

Session/Category Title: Fabulous Fabrication: From Knitting to Circuits




    We propose a computational design approach for covering a surface with individually addressable RGB LEDs, effectively forming a low-resolution surface screen. To achieve a low-cost and scalable approach, we propose creating designs from flat PCB panels bent in-place along the surface of a 3D printed core. Working with standard rigid PCBs enables the use of established PCB manufacturing services, allowing the fabrication of designs with several hundred LEDs.Our approach optimizes the PCB geometry for folding, and then jointly optimizes the LED packing, circuit and routing, solving a challenging layout problem under strict manufacturing requirements. Unlike paper, PCBs cannot bend beyond a certain point without breaking. Therefore, we introduce parametric cut patterns acting as hinges, designed to allow bending while remaining compact. To tackle the joint optimization of placement, circuit and routing, we propose a specialized algorithm that splits the global problem into one sub-problem per triangle, which is then individually solved.Our technique generates PCB blueprints in a completely automated way. After being fabricated by a PCB manufacturing service, the boards are bent and glued by the user onto the 3D printed support. We demonstrate our technique on a range of physical models and virtual examples, creating intricate surface light patterns from hundreds of LEDs.The code and data for this paper are available at https://github.com/mfremer/pcbend.


    1. Altium. 2014. Designing a Rigid-Flex PCB in Altium Designer. https://www.altium.com/documentation/altium-designer/designing-rigid-flex-pcb.
    2. Byoungkwon An, Ye Tao, Jianzhe Gu, Tingyu Cheng, Xiang ‘Anthony’ Chen, Xiaoxiao Zhang, Wei Zhao, Youngwook Do, Shigeo Takahashi, Hsiang-Yun Wu, Teng Zhang, and Lining Yao. 2018. Thermorph: Democratizing 4D Printing of Self-Folding Materials and Interfaces. In Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems (Montreal QC, Canada) (CHI ’18). Association for Computing Machinery, New York, NY, USA, 1–12.
    3. Kristin Angel, Harvey H. Tsang, Sarah S. Bedair, Gabriel L. Smith, and Nathan Lazarus. 2018. Selective electroplating of 3D printed parts. Additive Manufacturing 20 (2018), 164–172.
    4. David Applegate, Robert E. Bixby, Vašek Chvátal,, and William J. Cook. 2001. Concorde TSP. https://www.math.uwaterloo.ca/tsp/concorde/index.html.
    5. Autodesk. 1988. EAGLE. https://www.autodesk.com/products/eagle/overview.
    6. Bob Burns. 2020. How to Reduce Rigid Flex PCB Costs. https://www.printedcircuits.com/blog/reduce-rigid-flex-pcb-costs/ (Oct. 2020).
    7. Sebastien JP Callens and Amir A Zadpoor. 2018. From flat sheets to curved geometries: Origami and kirigami approaches. Materials Today 21, 3 (2018), 241–264.
    8. Jean-Pierre Charras. 1992. KiCad. https://www.kicad.org/.
    9. Weikai Chen, Yuexin Ma, Sylvain Lefebvre, Shiqing Xin, Jonàs Martínez, and wenping wang. 2017. Fabricable Tile Decors. ACM Trans. Graph. 36, 6, Article 175 (nov 2017), 15 pages.
    10. Weikai Chen, Xiaolong Zhang, Shiqing Xin, Yang Xia, Sylvain Lefebvre, and Wenping Wang. 2016. Synthesis of Filigrees for Digital Fabrication. ACM Trans. Graph. 35, 4, Article 98 (jul 2016), 13 pages.
    11. Ketan Dalal, Allison W. Klein, Yunjun Liu, and Kaleigh Smith. 2006. A Spectral Approach to NPR Packing. In Proceedings of the 4th International Symposium on Non-Photorealistic Animation and Rendering (Annecy, France) (NPAR ’06). Association for Computing Machinery, New York, NY, USA, 71–78.
    12. Erik D. Demaine and Joseph O’Rourke. 2007. Geometric Folding Algorithms: Linkages, Origami, Polyhedra. Cambridge University Press, Cambridge ; New York.
    13. Dania El-Khechen, Muriel Dulieu, John Iacono, and Nikolaj van Omme. 2009. Packing 2×2 unit squares into grid polygons is NP-complete. In Canadian Conference on Computational Geometry.
    14. Filippo Andrea Fanni, Fabio Pellacini, Riccardo Scateni, and Andrea Giachetti. 2022. PAVEL: Decorative Patterns with Packed Volumetric Elements. ACM Trans. Graph. 41, 2, Article 19 (jan 2022), 15 pages.
    15. Patrick F. Flowers, Christopher Reyes, Shengrong Ye, Myung Jun Kim, and Benjamin J. Wiley. 2017. 3D printing electronic components and circuits with conductive thermoplastic filament. Additive Manufacturing 18 (2017), 156–163.
    16. Robert J. Fowler, Mike Paterson, and Steven L. Tanimoto. 1981. Optimal Packing and Covering in the Plane are NP-Complete. Inf. Process. Lett. 12 (1981), 133–137.
    17. Daniel Groeger and Jürgen Steimle. 2018. ObjectSkin: Augmenting Everyday Objects with Hydroprinted Touch Sensors and Displays. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 1, 4, Article 134 (jan 2018), 23 pages.
    18. Daniel Groeger and Jürgen Steimle. 2019. LASEC: Instant Fabrication of Stretchable Circuits Using a Laser Cutter. In Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems (Glasgow, Scotland Uk) (CHI ’19). Association for Computing Machinery, New York, NY, USA, 1–14.
    19. Ollie Hanton, Michael Wessely, Stefanie Mueller, Mike Fraser, and Anne Roudaut. 2020. ProtoSpray: Combining 3D Printing and Spraying to Create Interactive Displays with Arbitrary Shapes. Association for Computing Machinery, New York, NY, USA, 1–13.
    20. Alejo Hausner. 2001. Simulating Decorative Mosaics. In Proceedings of the 28th Annual Conference on Computer Graphics and Interactive Techniques (SIGGRAPH ’01). Association for Computing Machinery, New York, NY, USA, 573–580.
    21. Liang He, Jarrid A. Wittkopf, Ji Won Jun, Kris Erickson, and Rafael Tico Ballagas. 2022. ModElec: A Design Tool for Prototyping Physical Computing Devices Using Conductive 3D Printing. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 5, 4, Article 159 (2022), 20 pages.
    22. Steve Hodges, Nicolas Villar, Nicholas Chen, Tushar Chugh, Jie Qi, Diana Nowacka, and Yoshihiro Kawahara. 2014. Circuit Stickers: Peel-and-Stick Construction of Interactive Electronic Prototypes. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (Toronto, Ontario, Canada) (CHI ’14). Association for Computing Machinery, New York, NY, USA, 1743–1746.
    23. Freddie Hong, Connor Myant, and David E Boyle. 2021. Thermoformed Circuit Boards: Fabrication of Highly Conductive Freeform 3D Printed Circuit Boards with Heat Bending.
    24. W. Hu, Z. Chen, H. Pan, Y. Yu, E. Grinspun, and W. Wang. 2016. Surface Mosaic Synthesis with Irregular Tiles. IEEE Transactions on Visualization and Computer Graphics 22, 03 (mar 2016), 1302–1313.
    25. Naveen Noah Jason, Wei Shen, and Wenlong Cheng. 2015. Copper nanowires as conductive ink for low-cost draw-on electronics. ACS applied materials & interfaces 7, 30 (2015), 16760–16766.
    26. Andriani-Melina Kalama, Danai Tzoni, and Ioanna Symeonidou. 2020. Kerf Bending: A Genealogy Of Cutting Patterns For Single And Double Curvature.
    27. Yoshihiro Kawahara, Steve Hodges, Benjamin S. Cook, Cheng Zhang, and Gregory D. Abowd. 2013. Instant Inkjet Circuits: Lab-Based Inkjet Printing to Support Rapid Prototyping of UbiComp Devices. In Proceedings of the 2013 ACM International Joint Conference on Pervasive and Ubiquitous Computing. 363–372.
    28. Myung Jun Kim, Mutya A. Cruz, Shengrong Ye, Allen L. Gray, Gabriel L. Smith, Nathan Lazarus, Christopher J. Walker, Hjalti H. Sigmarsson, and Benjamin J. Wiley. 2019. One-step electrodeposition of copper on conductive 3D printed objects. Additive Manufacturing 27 (2019), 318–326.
    29. Thorsten Korpitsch, Shigeo Takahashi, Eduard Gröller, and Hsiang-Yun Wu. 2020. Simulated annealing to unfold 3d meshes and assign glue tabs. (2020).
    30. Dongchi Lee, Kazuya Saito, Takuya Umedachi, Tung D Ta, and Yoshihiro Kawahara. 2018. Origami robots with flexible printed circuit sheets. In Proceedings of the 2018 ACM International Joint Conference and 2018 International Symposium on Pervasive and Ubiquitous Computing and Wearable Computers. 392–395.
    31. Yu-Ki Lee, Zhonghua Xi, Young-Joo Lee, Yun-Hyeong Kim, Yue Hao, Hongjin Choi, Myoung-Gyu Lee, Young-Chang Joo, Changsoon Kim, Jyh-Ming Lien, and In-Suk Choi. 2020. Computational wrapping: A universal method to wrap 3D-curved surfaces with nonstretchable materials for conformal devices. Science Advances 6, 15 (2020), eaax6212.
    32. Jens Lienig and Juergen Scheible. 2020. Fundamentals of Layout Design for Electronic Circuits. Springer International Publishing.
    33. Research Association Mechatronic Integrated Devices 3-D MID. 1992. 3D-MID Technology. https://www.3d-mid.de/en/technology/.
    34. Giovanni Gerardo Muscolo, Giacomo Moretti, and Giorgio Cannata. 2019. SUAS: A Novel Soft Underwater Artificial Skin with Capacitive Transducers and Hyperelastic Membrane. Robotica 37, 4 (2019), 756–777.
    35. Hyunjoo Oh, Tung D. Ta, Ryo Suzuki, Mark D. Gross, Yoshihiro Kawahara, and Lining Yao. 2018. PEP (3D Printed Electronic Papercrafts): An Integrated Approach for 3D Sculpting Paper-Based Electronic Devices. 1–12.
    36. Simon Olberding, Sergio Soto Ortega, Klaus Hildebrandt, and Jürgen Steimle. 2015. Foldio: Digital Fabrication of Interactive and Shape-Changing Objects With Foldable Printed Electronics. In Proceedings of the 28th Annual ACM Symposium on User Interface Software and Technology (Charlotte, NC, USA) (UIST ’15). Association for Computing Machinery, New York, NY, USA, 223–232.
    37. Simon Olberding, Michael Wessely, and Jürgen Steimle. 2014. PrintScreen: Fabricating Highly Customizable Thin-Film Touch-Displays. In Proceedings of the 27th Annual ACM Symposium on User Interface Software and Technology (Honolulu, Hawaii, USA) (UIST ’14). Association for Computing Machinery, New York, NY, USA, 281–290.
    38. Luis Paredes, Sai Swarup Reddy, Subramanian Chidambaram, Devashri Vagholkar, Yunbo Zhang, Bedrich Benes, and Karthik Ramani. 2021. FabHandWear: An End-to-End Pipeline from Design to Fabrication of Customized Functional Hand Wearables. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 5, 2, Article 76 (jun 2021), 22 pages.
    39. Bart Plovie, Maarten Cauwe, Frederick Bossuyt, and Jan Vanfleteren. 2017a. One-Time Deformable Thermoplastic Devices Based on Flexible Circuit Board Technology. ESA, 1.
    40. Bart Plovie, Yang Yang, Joren Guillaume, Sheila Dunphy, Kristof Dhaenens, Steven Van-Put, Björn Vandecasteele, Thomas Vervust, Frederick Bossuyt, and Jan Vanfleteren. 2017b. Arbitrarily Shaped 2.5D Circuits using Stretchable Interconnects Embedded in Thermoplastic Polymersθ. Advanced Engineering Materials 19, 8 (2017), 1700032.
    41. Konrad Polthier. 2009. Imaging maths – Unfolding polyhedra.
    42. Jie Qi and Leah Buechley. 2010. Electronic Popables: Exploring Paper-Based Computing through an Interactive Pop-up Book. In Proceedings of the Fourth International Conference on Tangible, Embedded, and Embodied Interaction (TEI ’10). Association for Computing Machinery, New York, NY, USA, 121–128.
    43. Steven I. Rich, Zhi Jiang, Kenjiro Fukuda, and Takao Someya. 2021. Well-rounded devices: the fabrication of electronics on curved surfaces – a review. Materials Horizons 8 (2021), 1926–1958. Issue 7.
    44. Analisa Russo, Bok Yeop Ahn, Jacob J. Adams, Eric B. Duoss, Jennifer T. Bernhard, and Jennifer A. Lewis. 2011. Pen-on-Paper Flexible Electronics. Advanced Materials 23, 30 (2011), 3426–3430.
    45. Wolfram Schlickenrieder. 1997. Nets of polyhedra. Unpublished. Technische Universitat Berlin (1997).
    46. Geoffrey C. Shephard. 1975. Convex polytopes with convex nets.
    47. Kaleigh Smith, Yunjun Liu, and Allison Klein. 2005. Animosaics. In Proceedings of the 2005 ACM SIGGRAPH/Eurographics Symposium on Computer Animation (Los Angeles, California) (SCA ’05). Association for Computing Machinery, New York, NY, USA, 201–208.
    48. Raphael Straub and Hartmut Prautzsch. 2011. Creating optimized cut-out sheets for paper models from meshes. Citeseer.
    49. Saiganesh Swaminathan, Kadri Bugra Ozutemiz, Carmel Majidi, and Scott E. Hudson. 2019. FiberWire: Embedding Electronic Function into 3D Printed Mechanically Strong, Lightweight Carbon Fiber Composite Objects. 1–11.
    50. Shigeo Takahashi, Hsiang-Yun Wu, Seow Hui Saw, Chun-Cheng Lin, and Hsu-Chun Yen. 2011. Optimized topological surgery for unfolding 3d meshes. In Computer graphics forum, Vol. 30. Wiley Online Library, 2077–2086.
    51. J J Toriz-Garcia, J J Cowling, G L Williams, Q Bai, N L Seed, A Tennant, R McWilliam, A Purvis, F B Soulard, and P A Ivey. 2013. Fabrication of a 3D electrically small antenna using holographic photolithography. Journal of Micromechanics and Micro-engineering 23, 5 (mar 2013), 055010.
    52. Cesar Torres, Jasper O’Leary, Molly Nicholas, and Eric Paulos. 2017. Illumination Aesthetics: Light as a Creative Material within Computational Design. In Proceedings of the 2017 CHI Conference on Human Factors in Computing Systems (Denver, Colorado, USA) (CHI ’17). Association for Computing Machinery, New York, NY, USA, 6111–6122.
    53. Nobuyuki Umetani and Ryan Schmidt. 2017. SurfCuit: Surface-Mounted Circuits on 3D Prints. IEEE Computer Graphics and Applications 37, 3 (2017), 52–60.
    54. Guanyun Wang, Fang Qin, Haolin Liu, Ye Tao, Yang Zhang, Yongjie Jessica Zhang, and Lining Yao. 2020. MorphingCircuit: An Integrated Design, Simulation, and Fabrication Workflow for Self-Morphing Electronics. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 4, 4 (2020).
    55. Tianyi Wang, Ke Huo, Pratik Chawla, Guiming Chen, Siddharth Banerjee, and Karthik Ramani. 2018. Plain2Fun: Augmenting Ordinary Objects with Surface Painted Circuits. In Extended Abstracts of the 2018 CHI Conference on Human Factors in Computing Systems. 1–6.
    56. Hao Wu, Yu Tian, Haibo Luo, Hui Zhu, Yongqing Duan, and YongAn Huang. 2020. Fabrication Techniques for Curved Electronics on Arbitrary Surfaces. Advanced Materials Technologies 5, 8 (2020), 2000093. arXiv:https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202000093
    57. Hao Xu, Ka-Hei Hui, Chi-Wing Fu, and Hao Zhang. 2020. TilinGNN: Learning to Tile with Self-Supervised Graph Neural Network. ACM Trans. Graph. 39, 4, Article 129 (jul 2020), 16 pages.
    58. Junichi Yamaoka, Mustafa Doga Dogan, Katarina Bulovic, Kazuya Saito, Yoshihiro Kawahara, Yasuaki Kakehi, and Stefanie Mueller. 2019. FoldTronics: Creating 3D Objects with Integrated Electronics Using Foldable Honeycomb Structures. In Proceedings of the 2019 CHI Conference on Human Factors in Computing Systems (Glasgow, Scotland Uk) (CHI ’19). Association for Computing Machinery, New York, NY, USA, 1–14.
    59. Zeyu Yan, Anup Sathya, Sahra Yusuf, Jyh-Ming Lien, and Huaishu Peng. 2022. Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits with a Fiber Laser Engraver. In Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology (Bend, OR, USA) (UIST ’22). Association for Computing Machinery, New York, NY, USA, Article 12, 13 pages.
    60. Junyi Zhu, Lotta-Gili Blumberg, Yunyi Zhu, Martin Nisser, Ethan Levi Carlson, Xin Wen, Kevin Shum, Jessica Ayeley Quaye, and Stefanie Mueller. 2020a. CurveBoards: Integrating Breadboards into Physical Objects to Prototype Function in the Context of Form. 1–13.
    61. Junyi Zhu, Yunyi Zhu, Jiaming Cui, Leon Cheng, Jackson Snowden, Mark Chounlakone, Michael Wessely, and Stefanie Mueller. 2020b. MorphSensor: A 3D Electronic Design Tool for Reforming Sensor Modules. Association for Computing Machinery, New York, NY, USA, 541–553.

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©Marco Freire, Manas Bhargava, Camille Schreck, Pierre-Alexandre Hugron, Bernd Bickel, and Sylvain Lefebvre

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